• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    The invention relates to an optoelectronic module (M) for converting an electrical signal from an electronic card into an optical signal or vice versa, comprising the following stack: an electronic card (1) intended to serve interfacing with an application electronic card; an electronic control component (2) adapted to carry out the control of an optoelectronic component, the electronic component being fixed directly on the electronic card and electrically connected to the electronic circuit; an optoelectronic component (3) adapted to emit or receive a light signal by its upper surface, the optoelectronic component being fixed directly on top of the electronic component and electrically connected to the electronic component; an optical device (9) adapted to transmit an optical signal; an optical device support (10), the support being fixed directly on the electronic card so as to ensure the mechanical alignment between the optical device and the optoelectronic component.
    公开号:FR3037190A1
    申请号:FR1554994
    申请日:2015-06-02
    公开日:2016-12-09
    发明作者:Vincent Foucal；Christian Claudepierre；Mathias Pez；Laurence Pujol；Francois Quentel
    申请人:Radiall SA；
    IPC主号:
    专利说明:

    [0001] TECHNICAL FIELD The present invention relates to an optoelectronic module for non-contact optical connection, generally intended to be used in the field of optoelectronic modules for non-contact optical connection. brazed on an electronic card also known PCB printed circuit board for "Printed Circuit Board" and said application card, and for converting electrical signals into optical signals or vice versa.It relates both to a transmitter module a receiver module and an interconnection system comprising at least one device with transmitter module and at least one device with receiver module adapted for optical coupling with the transmitter module, for converting an electrical signal into a signal by the transmitter module and a conversion of the optical signal emitted by the transmitter module and received by the receiver module in an electrical signal by the latter.
    [0002] The main application targeted by the invention is the connection between two electronic cards usually called card-to-card connection or "Board-to-Board" in English. More generally, the invention may relate to any link between two adjacent equipments, with, where appropriate, one and / or the other in relative displacement with respect to each other. The invention aims firstly to improve the compactness of the optoelectronic modules fixed on an electronic card, in particular to reduce the gripping area thereon. The invention relates generally to optical interconnection systems intended to be implemented in particular in the medical field, the aeronautical or transport field, the space domain or the telecommunications field, the field of data communications and the field of communication. industrial field, that is to say so-called "Market To Market" applications. STATE OF THE ART In order to provide interconnection systems between two electronic application cards, or in other words end-use cards, several types of connections are known. We can first mention the electrical connections between cards that have a number of major disadvantages for very high speed systems. First, when they have a high channel density, inter-channel electromagnetic interference is generated, which is detrimental to signal quality as the frequency of the signal increases. Secondly, the electrical connections as so-called backplane connections, which are useful in the field of telecommunications and data processing industries, can not easily implement very strong electrical signals. broadband on dimensions compatible with the maximum inter-card distance (on the backplane) because of the problems of attenuation and impedance matching. Contact optical link systems are also known which utilize optoelectronic modules and an optical link made by one or more optical fibers. Each emitter or receiver optoelectronic module usually designated by the acronym OSA for "Optical Subassembly" consists of an electronic card, an optoelectronic component and its electronic control component, of one or more optical fibers which may be concatenated into ribbons and an optical coupling device between the optoelectronic component and the optical fiber (s). Each OSA module is then fixed, preferably by brazing on an application card, a functional optical link system thus comprising at least one transmitter module (TOSA for "Transmitter Optical Subassembly") and at least one receiver module (ROSA for " Receiver Optical Subassembly ") optically coupled to the TOSA transmitter module.
    [0003] Commercial products called D-Lightsys® marketed by the applicant RADIALL may be mentioned which may concern both a ROSA module and a TOSA module, or a system integrating the two ROSA and TOSA modules. If these optical link systems have given and still give complete satisfaction, particularly in terms of performance, especially for high-speed signals, they can be further improved, particularly in terms of weight, bulk, and cost of producing the signals. modules. The needs related to certain embedded applications imply that the maximum space requirement that an optoelectronic module, whether the transmitter or the receiver, can occupy on each application card is very small. Thus, the surface area available on an application card of a module must be less than 100 mm2 for certain aeronautical applications.
    [0004] However, all optoelectronic fiber optic modules known, such as those present in the D-Lightsys® range, have a much greater surface area because of the implementation of the connections required to interface with the optical fiber, that is the implementation of the optical fiber directly within the TOSA or ROSA. In addition, there are other requirements to be taken into account for the lower surface area constraint: - to ensure an electro-optical (transmitter) and optoelectronic (receiver) conversion of digital or analog signals in a band of 0 to several tens of 10 gigabits per second (Gbps) or Gigahertz, - allow to pass the optical signal from one card to another despite imperfect transmitter / receiver alignment (lateral and angular offset) and to ensure the continuity of the link in these conditions, - define a robust link, that is to say, compatible with environments 15 of highly constrained environments, such as aerospace, aeronautics, medical, telecommunications and defense, and in particular be capable of operating at temperatures from -40 ° C to + 85 ° C, withstanding shocks and vibrations in accordance with current aeronautical standards, - having very low power consumption, typically below at 150 mW. In addition, there may also be an interest in finding alternative techniques in the case where the new broadband links must be integrated into a system of which several elements remain fixed, such as a backplane for example. There is therefore a particular need to improve optical links without mechanical contact with optoelectronic modules, in order to reduce the surface area of the latter on the electronic boards on which they are intended to be fixed. More generally, there is a need to improve non-contact optical optoelectronic module links which meet the particular need, particularly in order to allow a low to very low card-to-card distance, to provide electro-optical conversion and an optoelectronic conversion of high-speed signals, to allow the effective transmission of signals despite alignment between transmitter module and imperfect receiver module, to be compatible with aeronautical environments, and to have a reduced power consumption.
    [0005] The object of the invention is to respond at least in part to this (these) need (s). SUMMARY OF THE INVENTION To this end, the object of the invention is an optoelectronic module intended to ensure conversion of an electrical signal from an electronic card into an optical signal or vice versa, comprising the following stack: an electronic card intended to interface with an electronic application card; an electronic control component adapted to carry out the control of an optoelectronic component, the electronic component being fixed directly on the electronic card and electrically connected to the electronic circuit; an optoelectronic component adapted to emit or receive a light signal by its upper surface, the optoelectronic component being fixed directly on top of the electronic control component and electrically connected to the electronic component; An optical device adapted to transmit an optical signal; an optical device support, the support being fixed, preferably by gluing or brazing, directly on the electronic card so as to ensure the mechanical alignment between the optical device and the optoelectronic component. It is specified that in the context of the invention, the electronic card of the optoelectronic module 20 is a printed circuit or a stack of sheets of dielectric materials, such as alumina, in which an electrical circuit is produced. The electronic board module is necessarily independent of the electronic card application or end use on which the module according to the invention is intended to be fixed. The attachment of an optoelectronic module according to the invention to an application card can be achieved by the electrical interconnections of the latter. Alternatively, the electrical interconnections on the application card can be replaced by a removable connection using electrical connectors on the module and on the application card for a demountable / remountable module. By "optoelectronic component" and "electronic control component" is meant here and in the context of the invention, bare components, that is to say which are not wrapped in a package or otherwise encapsulated in an electrical insulating coating, also commonly called "packaging" in English.
    [0006] The module according to the invention may constitute an emitter module, the electronic control component being a control circuit of optoelectronic components emitting by the surface. It may be a control circuit of a surface-emitting vertical cavity laser diode of the VCSEL type or an LED or any other vertical light-emitting component. The optoelectronic module according to the invention may also constitute a receiver module, the electronic control component being a transimpedance amplifier, the optoelectronic component being a photodiode, in particular a PIN photodiode.
    [0007] The electronic control component can be glued or brazed or fixed in a so-called "flip-chip" technique directly on the surface of the electronic card. Similarly, the optoelectronic component can be glued, brazed or fixed according to a so-called "flip-chip" technique directly on the surface of the electronic control component. The optical device can be a lens. This lens may be a refractive lens or a diffractive lens. According to an advantageous embodiment variant, the module according to the invention comprises a cover fixed directly on the electronic card, the cover being adapted to mechanically protect the components and the electronic card and, if appropriate, the lens and its support vis-à- vis-à-vis the outside environment. Preferably, the hood is adapted to hold the lens in its holder. According to a variant instead of the lens, it is possible to use a window that is transparent to at least one emission or reception wavelength of the optoelectronic component. It may be a plane blade arranged directly above the stack of the module, that is to say directly above the optoelectronic component. According to this variant, the cover may comprise, on its upper face, a window transparent to at least one emission or reception wavelength of the optoelectronic component, the transparent window being hermetically sealed to the body of the cover. Whatever the optical device arranged above a module according to the invention, it is advantageously possible to determine its divergence or convergence characteristics as a function of the distance between a transmitter module and a receiver module, so that the ratio between the light intensity emitted by the transmitter module and the intensity sensed by the receiver module varies between 5 and 25 dB approximately.
    [0008] The substrate of the electronic card may comprise on its upper face, one or more of the following characteristics in combination: at least one first group of marks forming positioning patterns of the optoelectronic component relative to the electronic card; At least one second group of marks forming positioning patterns of the optoelectronic component relative to the lens support; at least a third group of marks forming positioning patterns of the optoelectronic module relative to an electronic application card on which the module is intended to be fixed. This third group of patterns may also be on the lower face or on at least one of the lateral faces of the substrate of the electronic card. The three groups of marks are advantageously grouped into one in the proposed invention in order to optimize the relative alignments. Conventional self-alignment techniques in surface-mounted components (CMS) such as Quad Flat Non-Leads (QFN) can help to overcome this third set of marks. Advantageously, each pattern consists of a grid of adjacent squares, two adjacent squares having a contrast between them. The substrate of the electronic card may comprise an electrical connector intended to be connected with a complementary electrical connector connected to the electronic application card. The invention relates in another aspect to a multi-channel module comprising at least two optoelectronic modules described above with a common electronic card on which the electronic control components are fixed. The multichannel module may include an optical device and an optical device support common to the optoelectronic modules. One of the two optoelectronic modules can be a transmitter module and the other of the two modules a receiver module. The optoelectronic modules of the same multichannel module can all be of the same type, transmitter or receiver. In this case, advantageously, the optoelectronic components are all made in the same chip generally called a strip. In the same way, the electronic control components of the optoelectronic modules can be associated in a bar.
    [0009] The multichannel module may comprise at least two emitter modules such as laser diodes that can operate at different wavelengths. This makes it easier to differentiate the optical channels. The invention also relates to an optical interconnection system 5 comprising: at least one transmitter module described above; at least one receiver module described above. The invention also relates, in yet another of its aspects, to a process for producing an optoelectronic module described above, comprising the following steps: mechanical positioning of the electronic control component with respect to the electronic card and then fixing the control component directly on the map; - mechanical alignment of the optoelectronic component with respect to the electronic card by means of the first group of sights, then attachment of the optoelectronic component aligned, directly on the fixed control component; - Mechanical alignment of the optical device carrier with respect to the optoelectronic component by means of the second group of sights, and then fixing the aligned optical device carrier, directly on the card. The invention finally relates to a method for connecting an optoelectronic module 20 previously described on an electronic application card, comprising a step of mechanical alignment of the optoelectronic module with respect to the electronic application card by means of the third group of and then fixing the aligned optoelectronic module, directly on the electronic application card, preferably by reflow soldering according to a so-called surface-mounted component (CMS) technique.
    [0010] Thanks to the stacking of bare components on an electronic card, the surface area of an optoelectronic module according to the invention is much smaller than a module according to the state of the art. With the usual dimensions of optoelectronic components and electronic control components, the footprint area of a module according to the invention on an application card may be less than 100 mm 2, typically of the order of 64 mm 2. A subsequent advantage of direct stacking is that the optoelectronic component, especially a VCSEL laser, can be maintained in a favorable low temperature thermal environment by the control component below, particularly by the laser driver. The lower chip plays the role of heat sink. Transmitter and receiver optoelectronic modules according to the invention can be used to make a card-to-board optical link with a small or very small distance, typically less than about 10 mm, since the transmission and reception of signals optics by the active surface of a VCSEL laser or a PIN photodiode respectively, is very efficient without loss even at a high rate. And for the same reason, transmitter and receiver optoelectronic modules according to the invention can also be used to make a card-to-board optical link with a high distance, typically of a few tens of mm. Groups of sights as visual markers make it possible in a simple manner to achieve a very precise mechanical alignment between the components of a module according to the invention and of the latter with the application card to which it is attached, and this at the using a standard component positioning machine, commonly referred to as "pick 15 and place". With a transmitter module and a receiver module according to the invention, the inventors believe that an optical link can be obtained for a wide range of applications because it is possible to vary the parameters of: distance between transmitter module and receiver module between 1 and 400 mm, 20 - the rate of digital signals transmitted between 0 and several tens of Gbps, - axial misalignment tolerances of 0 to 10 mm, and angular of 0 to 10 °. Typically with a footprint area on a board of the order of 64 mm 2 being able to be reduced to 16 mm 2, a module according to the invention can have a maximum bit rate of digital signals of 10 Gbps or more for a card distance. 50 mm card.
    [0011] The advantages of an optoelectronic module according to the invention compared to an optoelectronic module with optical fiber (s) according to the state of the art are thus numerous among which we can mention: - reduction of the size of the module , and in particular of the footprint surface on an application card, which makes it possible to respond to card-to-card connection applications at low or very low distance, typically from 1 to several tens of mm; - Weight reduction due to the removal of elements including the optical coupling device between optoelectronic component and optical fiber (s); 8 3037190 - cost optimization because optical fibers can represent a significant cost of the price of an optoelectronic module; - ease of reconfiguring a transmitter and receiver module system according to the invention and disconnect an electronic card from a backplane: in fact, with a module according to the invention, a card can be replaced by another in a backplane without difficulties related to the presence of optical fibers, and / or to meet the needs of very precise alignments; - possibility of establishing an optical link communication between two elements requiring a very fast disconnection if necessary; 10 - ease of installation on the board with the standard electronic transfer equipment because there is no implementation of optical fibers to manage and the alignment accuracies are compatible with the positioning accuracy of the application cards. DETAILED DESCRIPTION Other advantages and features of the invention will become more apparent upon reading the detailed description of exemplary embodiments of the invention, given by way of nonlimiting illustration and with reference to the following figures among which: FIG. 1 is a schematic side view of an exemplary embodiment of an optoelectronic module according to the invention; FIG. 2 is a perspective view of an example of an optoelectronic module according to a variant of the invention; FIG. 2A is a sectional view of the module according to FIG. 2 in the transmitter version; FIG. 3 is an exploded view of the main components of the transmitter module according to FIG. 2A; FIG. 4 is a perspective view of FIG. an example of optoelectronic module in the receiver version according to a variant of the invention, - Figure 5 is a top view of an electronic card of a module according to the invention, the figure showing a first focus group for mechanical alignment between the board and the optoelectronic component; FIG. 6 is a view from above of an electronic card of a module according to the invention, the figure showing a second group of sight allowing mechanical alignment between the optoelectronic component and the support of the optical lens, FIG. 7 is a view from above of an electronic card of a module according to the invention, the figure showing a third group of sight allowing mechanical alignment between the optoelectronic module and the application card on which it 8A to 8D show diagrammatically different configurations of optical interconnection systems with at least one emitting optoelectronic module and a receiver module according to the invention, some systems being constituted by multichannel modules. In the overall application, the terms "vertical", "lower", "upper", "lower", "upper", "lower", "above" are to be understood by reference to the meaning of the stacking the various components of an optoelectronic module according to the invention. FIG. 1 shows an optoelectronic module M according to the invention. The various elements of the module M are stacked on top of each other and fixed together, preferably by gluing by means of an epoxy adhesive, for example, or by soldering. Thus, from the bottom to the top of the stack, the module M comprises: a printed circuit 1 which will serve as an interface with an electronic application card; an electronic control component 2 fixed directly to the printed circuit 1 and electrically connected to the electronic circuit by soldered wires 4 according to a "wire-bonding" technique; an optoelectronic component 3 adapted to emit or receive a light signal by its upper surface, the optoelectronic component being fixed directly on top of the electronic control component and electrically connected to the electronic component by a wired micro-wiring technique, for example by means of welded son 5, or by a "flip-chip" assembly technique or other techniques of electronic interconnection of conventional microelectronics. Components 2 and 3 are naked, i.e. unencapsulated components. Instead of a printed circuit board (PCB), an electronic board may also be provided whose substrate consists of a stack of layers or sheets of dielectric materials, such as alumina and in which a circuit of electrical conductors is arranged.
    [0012] As illustrated in FIG. 1, the attachment respectively of the electronic control component 2 to the circuit 1 and the optoelectronic component to the control component 2 can be effected by means of an epoxy resin glue for example or a solder 6 respectively. 7. Alternatively, the "flip-chip" assembly technique may also be used. This technique makes it possible to simultaneously ensure the function of mechanical fastening and electrical connection. Other classical techniques such as collective wiring, 3D wiring, etc. ... can also be used. The optoelectronic module according to the invention may be an emitter module as illustrated in FIGS. 2, 2A and 3, in which case the optoelectronic component 3 is a vertical cavity surface-emitting laser 10 (VCSEL for "Vertical-Cavity Surface-Emitting Laser" ) or any other optoelectronic component emitting by the surface and the electronic component 2 is a laser driver unit ("driver" in English). The optoelectronic module according to the invention may be a receiver module as illustrated in FIG. 4, in which case the optoelectronic component 3 is a PIN type photodiode and the electronic component 2 is a transimpedance amplifier for a photodiode. The stack shown in FIG. 1 allows the optoelectronic module according to the invention to have a small footprint on an application card. Advantageously, the module according to the invention comprises a cover 8 to mechanically protect the components 2, 3, 4, 5, 6, 7, 9 of the stack and the printed circuit 1. According to the invention, as illustrated in FIGS. 2 to 4, the module M comprises a lens 9 mounted in a support 10 directly fixed, preferably by soldering or gluing to the printed circuit 1. The support 10 of the lens 9 is dimensioned and fixed so as to ensure the mechanical alignment between the lens 9 and the optoelectronic component 3. Thus the optical device is not in direct contact with the active surface of the optoelectronic component and does not risk damaging it. The lens 9 may advantageously be a spherical lens as in the receiver module MR illustrated in FIGS. 2, 2A and 3. It may also be a simple transparent optical window as in the emitter module ME in FIG. 4.
    [0013] As can be seen in FIG. 2 for the transmitter module ME and in FIG. 4 for the receiver module MR, the cover 8 mechanically protects the device 9 already aligned in its support 10.
    [0014] According to an advantageous embodiment, alignment target groups 11, 12, 13 are provided directly on the upper surface of the printed circuit 1, which makes it possible in a simple manner to obtain mechanical alignments between each constituent component of the circuit. the stack of a module according to the invention and the latter with the application card 5 on which it is intended to be fixed. Guaranteeing the mechanical alignments makes it possible to guarantee optical alignments necessary for the proper functioning of the optoelectronic system integrating at least one emitter module ME and at least one receiver module MR which converts into an digital signal an optical signal emitted by the emitter module.
    [0015] All the patterns 11, 12, 13 which allow the different mechanical alignments preferably consist of a grid of adjacent tiles, two adjacent tiles being of different contrast, in particular by local color change of the printed circuit substrate 1 as shown in FIGS. 5 to 7. The patterns 11, 12, 13 make it possible, as will be explained later, to ensure mechanical alignments with a conventional component positioning machine, generally known by the name "pick and place" machine. Thus, firstly, the patterns 11 allow a mechanical alignment between the printed circuit 1 of the module and the optoelectronic component 3 by the positioning of lines L1 coinciding with the patterns 11, as shown in FIG.
    [0016] The sights 12 allow a mechanical alignment between the optoelectronic component 3 and the support 10 of the lens 9 by the positioning of lines L2 in coincidence with the patterns 12, as shown in FIG. 6. The mechanical alignment makes it easy to achieve a positioning tolerance of the support 10 and therefore of the optical lens 9 with respect to the optoelectronic component 3 along the three axes x, y and z such that no adjustment operation of the laser beam is necessary once the module according to the invention fixed on its application card. The absence of dynamic alignment, that is to say with components under electrical tension, allows assembly at lower cost. Finally, the patterns 13 allow a mechanical alignment between the printed circuit 1 and the application card on which the optoelectronic module is placed before being fixed, by the positioning of lines L3 coinciding with the patterns 12, as 6. An optoelectronic module according to the invention can therefore be easily aligned by a client-user having the application card, preferably by a CMS surface-mounted component technique then fixed in particular welded by reflow.
    [0017] As can be seen from the mode illustrated in FIGS. 5 to 7, the groups of patterns 11, 12, 13 may have patterns in common. The main steps for producing an optoelectronic module M according to the invention are therefore the following: 5 - mechanical positioning of the electronic control component 2 with respect to the printed circuit 1, then fixing the control component 2 directly on the card; - Mechanical alignment of the optoelectronic component 3 with respect to the printed circuit 1 by means 11, and then fixing the optoelectronic component aligned directly to the control component 2 fixed; - Mechanical alignment of the lens support 10 with respect to the optoelectronic component by means of the sights 12, and then fixing the aligned lens support 10, directly on the printed circuit 1. Once the optoelectronic module M has been made, it can advantageously be provided with 15 a cover that caps and mechanically protect all components including the top of the lens 9. This cover can for example snap onto the edges of the cover 8. Thus, during transport and handling of the module M until it is put in place and fixed on an application card, all the components of the module are protected mechanically. A customer-user only has to remove this cover, in particular by simply unclipping manually or with a tool immediately before setting up on the application card. A client-user of the application card then has to carry out only a step of mechanical alignment of the optoelectronic module M according to the invention with respect to the electronic application card by means of the test patterns 13, then the fixing of the module 25 optoelectronic M aligned directly on the electronic board application, preferably by reflow soldering according to a so-called surface mounted component (CMS) technique. FIG. 8A describes the configuration of an optical interconnection system with an emitter-type optoelectronic module such as that illustrated in FIG. 2 which is interconnected with an emitter-type optoelectronic module such as that illustrated in FIG. 4. It is possible to envisage associating at least two optoelectronic modules according to the invention which have just been described in the same multichannel module. In this case, the two or more optoelectronic modules are fixed on the same printed circuit 1.
    [0018] In a variant, it is possible to provide that, within a multi-channel module, all the optoelectronic modules share the same optical device 9 and the same optical device support 10. In a variant, as shown in FIG. 8B, all the optoelectronic modules of FIG. The same multichannel module may be of the same type, transmitter or receiver, for example laser diodes or photodiodes. Thus, as shown in this FIG. 8B, a multi-channel module comprising a number n of transmitter modules is interconnected with a multi-channel module comprising the same number n of receiver modules. As a variant, the laser diodes can operate at the same wavelength X.
    [0019] In this case, advantageously, a single chip called a strip will comprise the laser diodes. According to another variant, the laser diodes can operate at different wavelengths X1 and X2 for example as shown in FIG. 8D. In another variant illustrated in FIG. 8C, a multichannel module may comprise at least one laser diode and one photodiode.
    [0020] Other variants and improvements may be provided without departing from the scope of the invention. The expression "having one" shall be understood as being synonymous with "having at least one", unless the opposite is specified. 14
    权利要求:
    Claims (21)
    [0001]
    REVENDICATIONS1. Optoelectronic module (M) for converting an electrical signal from an electronic card into an optical signal or vice versa, comprising the following stack: an electronic card (1) intended to interface with a electronic map of application; an electronic control component (2) adapted to carry out the control of an optoelectronic component, the electronic component being fixed directly on the electronic card and electrically connected to the electronic circuit; an optoelectronic component (3) adapted to emit or receive a light signal by its upper surface, the optoelectronic component being fixed directly on top of the electronic control component and electrically connected to the electronic component; an optical device (9) adapted to transmit an optical signal; an optical device support (10), the support being fixed, preferably by gluing or brazing, directly on the electronic card so as to ensure the mechanical alignment between the optical device and the optoelectronic component.
    [0002]
    2. Optoelectronic module according to claim 1 constituting an emitter module (ME), the electronic control component being a control circuit of optoelectronic components emitting by the surface.
    [0003]
    3. Optoelectronic module according to claim 1 constituting a receiver module (MR), the electronic control component being a transimpedance amplifier, the optoelectronic component being a photodiode, in particular a PIN photodiode.
    [0004]
    4. Optoelectronic module according to one of the preceding claims, the electronic control component being glued or brazed or fixed by a technique called "flip chip" ("flip chip" in English) directly on the surface of the electronic card.
    [0005]
    5. Optoelectronic module according to one of the preceding claims, the optoelectronic component being glued, brazed or fixed by a so-called "flip chip" technique directly on the surface of the electronic control component.
    [0006]
    Optoelectronic module according to one of the preceding claims, the optical device being a refractive lens or a diffractive lens. 15 3037190
    [0007]
    7. Optoelectronic module according to one of the preceding claims, comprising a cover (8) directly attached to the electronic card, the cover being adapted to mechanically protect the components and the electronic card and if necessary the lens and its support vis-à-vis -vis the external environment. 5
    [0008]
    8. Optoelectronic module according to one of the preceding claims, the substrate of the electronic card comprising on its upper face, at least a first group of marks (11) forming positioning patterns of the optoelectronic component relative to the electronic card.
    [0009]
    9. Optoelectronic module according to one of claims 6 to 8, the substrate of the electronic card comprising on its upper face, at least a second group of marks (12) forming positioning patterns of the optoelectronic component relative to the lens holder .
    [0010]
    10. Optoelectronic module according to one of the preceding claims, the substrate of the electronic card comprising on its upper face or on its lower face or on at least one of the lateral faces, at least a third group of marks (13). forming optoelectronic module positioning patterns relative to an electronic application card on which the module is intended to be fixed.
    [0011]
    11. Optoelectronic module according to one of the preceding claims, the substrate of the electronic card comprising an electrical connector intended to be connected to a complementary electrical connector connected to the electronic application card.
    [0012]
    12. Multichannel module comprising at least two optoelectronic modules according to one of claims 6 to 10, with a common electronic card on which the electronic control components are fixed.
    [0013]
    13. Multichannel module according to claim 12, comprising an optical device and an optical device support common to the optoelectronic modules.
    [0014]
    14. Multichannel module according to claim 12 or 13, one of the two modules being a transmitter module and the other of the two modules being a receiver module.
    [0015]
    15. Multichannel module according to claim 12 or 13, whose optoelectronic modules are all transmitting modules or receiver modules. 30
    [0016]
    16. multichannel module according to claim 14, the optoelectronic components being all made in the same chip usually called bar. 16 3037190
    [0017]
    17. Multichannel module according to claim 14 or 15, the electronic control components being all made in the same chip type in the form of a bar.
    [0018]
    18. multichannel module according to one of claims 12 to 17, with at least two emitter modules operating at different wavelengths.
    [0019]
    Optical interconnection system comprising: at least one transmitter module according to one of claims 2 to 11; at least one receiver module according to one of claims 3 to 11.
    [0020]
    20. A method of producing an optoelectronic module according to one of claims 1 to 11, comprising the following steps: - mechanical positioning of the electronic control component relative to the electronic card and fixing the control component directly on the card ; - mechanical alignment of the optoelectronic component with respect to the electronic card by means of the first group of sights, then attachment of the optoelectronic component aligned, directly on the fixed control component; - Mechanical alignment of the optical device carrier with respect to the optoelectronic component by means of the second group of sights, and then fixing the aligned optical device carrier, directly on the card.
    [0021]
    21. A method of connecting an optoelectronic module according to one of claims 1 to 11 on an electronic application card, comprising a step of mechanical alignment of the optoelectronic module with respect to the electronic application card by means of third group of sights, then fixing the aligned optoelectronic module, directly on the electronic application card. 25 17
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    同族专利:
    公开号 | 公开日
    US20160356643A1|2016-12-08|
    JP2016225631A|2016-12-28|
    FR3037190B1|2017-06-16|
    EP3101699A1|2016-12-07|
    US10337913B2|2019-07-02|
    CN106226871A|2016-12-14|
    CN106226871B|2020-05-22|
    EP3101699B1|2017-12-13|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    JPS5925284A|1982-08-03|1984-02-09|Nec Corp|Photosemiconductor device|
    US4727457A|1986-01-24|1988-02-23|U.S. Philips Corporation|Surface-mounted optoelectronic device|
    US5266794A|1992-01-21|1993-11-30|Bandgap Technology Corporation|Vertical-cavity surface emitting laser optical interconnect technology|
    EP0585186A2|1992-08-28|1994-03-02|Eastman Kodak Company|Semiconductor insulation for optical devices|
    US5783815A|1995-10-24|1998-07-21|Sony Corporation|Light receiving device having lens fitting element|
    US6393183B1|1998-08-13|2002-05-21|Eugene Robert Worley|Opto-coupler device for packaging optically coupled integrated circuits|
    US20040080658A1|2001-03-16|2004-04-29|Pierre Cambou|Low cost electronic camera made using integrated circuit technology|
    WO2004049022A2|2002-11-26|2004-06-10|Hymite A/S|Opto-electronic micro-module with an integrated lens|
    US20040184737A1|2003-02-24|2004-09-23|Ngk Spark Plug Co., Ltd.|Substrate assembly for supporting optical component and method of producing the same|
    US20110058817A1|2008-05-07|2011-03-10|Huei Pei Kuo|Arrays, system and method for bi-directional data transmission|
    JPH05122160A|1991-10-28|1993-05-18|Toshiba Corp|Optical device and optical communication network equipment|
    US5276756A|1991-12-06|1994-01-04|Amoco Corporation|High speed electro-optical signal translator|
    JPH0878783A|1994-06-28|1996-03-22|Nippon Telegr & Teleph Corp <Ntt>|Optical coupler and parallel optical interconnection device|
    KR100231152B1|1996-11-26|1999-11-15|윤종용|Mounting method for mounting ic on pcb|
    JP3894603B2|1996-12-12|2007-03-22|ローム株式会社|Image sensor|
    DE19727633C2|1997-06-28|2001-12-20|Vishay Semiconductor Gmbh|Component for directional, bidirectional, optical data transmission|
    JP2000022285A|1998-07-01|2000-01-21|Canon Inc|Optoelectric fusion device|
    JP4532688B2|2000-07-19|2010-08-25|キヤノン株式会社|Device with surface optical element|
    US6882195B2|2002-07-12|2005-04-19|Ics Technologies, Inc.|Signal timing adjustment circuit with external resistor|
    US7264378B2|2002-09-04|2007-09-04|Cree, Inc.|Power surface mount light emitting die package|
    EP1602953A1|2004-05-31|2005-12-07|STMicroelectronics S.r.l.|A package for housing at least one electro-optic element and the corresponding assembly method|
    US20060045530A1|2004-08-31|2006-03-02|Lim Sin H|Compact optical transceiver module|
    JP2006261380A|2005-03-17|2006-09-28|Rohm Co Ltd|Optical communication module|
    JP4784123B2|2005-03-28|2011-10-05|富士ゼロックス株式会社|Multi-spot surface emitting laser and manufacturing method thereof|
    JP2008258298A|2007-04-03|2008-10-23|Rohm Co Ltd|Optical communication module|
    JP2010225824A|2009-03-24|2010-10-07|Hitachi Ltd|Optical module and wavelength multiplex optical module|
    JP2010251536A|2009-04-16|2010-11-04|Alps Electric Co Ltd|Laser chip positioning method|
    JP5257477B2|2011-03-07|2013-08-07|日本電気株式会社|Optical space communication device, communication method therefor, and optical space communication system|
    WO2013046416A1|2011-09-29|2013-04-04|富士通株式会社|Optical module|
    CN203223862U|2013-04-09|2013-10-02|中蓝光电科技（上海）有限公司|LED illuminating device with microstructural optical film|
    CN203273422U|2013-05-23|2013-11-06|浙江奥司朗照明电器有限公司|LED lamp|
    CN204164737U|2014-09-30|2015-02-18|廖敏和|A kind of compact LED lamp|JP1567062S|2016-04-18|2017-01-16|
    USD845918S1|2016-04-18|2019-04-16|Citizen Electronics Co., Ltd.|Light emitting diode|
    USD845917S1|2016-04-18|2019-04-16|Citizen Electronics Co., Ltd.|Light emitting diode|
    JP1581164S|2016-12-15|2017-07-10|
    FR3066339A1|2017-05-11|2018-11-16|Thales|FSOI COMPACT MODULE RESISTANT TO SEVERE ENVIRONMENTS|
    CN108259087A|2018-02-07|2018-07-06|江苏奥雷光电有限公司|The method of the optical WDM communication of high speed free space|
    CN108809425A|2018-08-27|2018-11-13|上海航天科工电器研究院有限公司|The wavelength-division multiplex of high speed free-space optical transmission/demultiplexing communication device|
    法律状态:
    2016-05-24| PLFP| Fee payment|Year of fee payment: 2 |
    2016-12-09| PLSC| Search report ready|Effective date: 20161209 |
    2017-05-23| PLFP| Fee payment|Year of fee payment: 3 |
    2018-05-25| PLFP| Fee payment|Year of fee payment: 4 |
    2020-05-20| PLFP| Fee payment|Year of fee payment: 6 |
    优先权:
    申请号 | 申请日 | 专利标题
    FR1554994A|FR3037190B1|2015-06-02|2015-06-02|OPTOELECTRONIC MODULE FOR MECHANICAL CONTACTLESS OPTICAL LINK, MODULE ASSEMBLY, INTERCONNECTION SYSTEM, METHOD FOR MAKING AND CONNECTING TO AN ASSOCIATED CARD|FR1554994A| FR3037190B1|2015-06-02|2015-06-02|OPTOELECTRONIC MODULE FOR MECHANICAL CONTACTLESS OPTICAL LINK, MODULE ASSEMBLY, INTERCONNECTION SYSTEM, METHOD FOR MAKING AND CONNECTING TO AN ASSOCIATED CARD|
    EP16170679.1A| EP3101699B1|2015-06-02|2016-05-20|Optoelectronic module for contactless optical link, related multi-channel modules, interconnection system, and associated method for manufacturing and connecting to a card|
    JP2016109835A| JP2016225631A|2015-06-02|2016-06-01|Photoelectric module for non-contact free space optical link, relevant multi-channel module, relevant interconnection system, method of manufacturing substrate and connection method|
    CN201610387796.XA| CN106226871B|2015-06-02|2016-06-02|Optoelectronic module, multichannel module, interconnection system, method of manufacturing and connecting to a board for a contactless free-space optical link|
    US15/171,940| US10337913B2|2015-06-02|2016-06-02|Optoelectronic module for a contactless free-space optical link, associated multichannel modules, associated interconnection system, method of production and connection to a board|
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